Superior Automation – Fab Automation | Wet Process Equipment Solutions

Semi-Automated Benches

Our semi-automated benches, the SA 2000’s, are a long-standing solution for a variety of applications within the semiconductor industry and beyond. The SA 2000 line leaves the smallest footprint available and has the lowest cost of ownership all while keeping it easy to use and easy to maintain.

Superior Automation specializes in making our products extremely flexible and customizable. Below are a few examples of tools we are currently supporting in fabs across the world.

Standard Features
  • Rotational Tank to Tank Transfer
  • Multi-Tank Operation
  • 25 to 100 Wafer Lots
  • 75mm to 300mm Wafers
  • Multi-Step Processing Recipes
  • Multi-Wafer Size Lot Processing
  • Advanced Intelligent Process Controls
  • Multi-Motion Agitation Profiles
  • Advanced Wafer Handling
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Standard and Custom Applications
  • Automated Load Port Door
  • Class 10 Mini Environment
  • Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
  • Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • IN-Line Chemical Metrology System
  • Fixed or Multi-Frequency Megasonics 750kHz to 2.0mHz
  • Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Single or Double Sided Single Wafer Scrub Station
  • Cassette-less Wafer Processing
  • GEM/SECS Host Interface
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Cleaning
  • Developing
  • Etching
  • Plating
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering
Standard Features
  • Front to Back Tank to Tank Transfer
  • Multi-Tank Operation
  • 25 to 1 00 Wafer Lots
  • 75mm to 300mm Wafers
  • Multi-Step Processing Recipes
  • Multi-Wafer Size Lot Processing
  • Automated Load Port Door
  • Class 10 Mini Environment
  • Advanced Intelligent Process Controls
  • IN-Line Chemical Metrology System
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • Multi-Motion Agitation Profiles
  • Optimized Wafer Handling
  • 100% GEM Compliant
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Standard and Custom Applications
  • Automated Load Port Door
  • Class 10 Mini Environment
  • Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
  • Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • IN-Line Chemical Metrology System
  • Fixed or Multi-Frequency Megasonics 750kHz to 2.0mHz
  • Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Single or Double Sided Single Wafer Scrub Station
  • Cassette-less Wafer Processing
  • GEM/SECS Host Interface
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Cleaning
  • Developing
  • Etching
  • Plating
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering
Standard Features
  • Front to Back Tank to Tank Transfer
  • Multi-Tank Operation
  • 25 to 1 00 Wafer Lots
  • 75mm to 300mm Wafers
  • Multi-Step Processing Recipes
  • Multi-Wafer Size Lot Processing
  • Automated Load Port Door
  • Class 10 Mini Environment
  • Advanced Intelligent Process Controls
  • IN-Line Chemical Metrology System
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • Multi-Motion Agitation Profiles
  • Optimized Wafer Handling
  • 100% GEM Compliant
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Standard and Custom Applications
  • Automated Load Port Door
  • Class 10 Mini Environment
  • Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
  • Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • IN-Line Chemical Metrology System
  • Fixed or Multi-Frequency Megasonics 750kHz to 2.0mHz
  • Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Single or Double Sided Single Wafer Scrub Station
  • Cassette-less Wafer Processing
  • GEM/SECS Host Interface
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Cleaning
  • Developing
  • Etching
  • Plating
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering
Standard Features
  • Rotational Tank to Tank Transfer
  • Multi-Tank Operation
  • 25 to 100 Wafer Lots
  • 75mm to 300mm Wafers
  • Multi-Step Processing Recipes
  • Multi-Wafer Size Lot Processing
  • Advanced Intelligent Process Controls
  • Multi-Motion Agitation Profiles
  • Advanced Wafer Handling
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Standard and Custom Applications
  • Automated Load Port Door
  • Class 10 Mini Environment
  • Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
  • Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • IN-Line Chemical Metrology System
  • Fixed or Multi-Frequency Megasonics 750kHz to 2.0mHz
  • Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Single or Double Sided Single Wafer Scrub Station
  • Cassette-less Wafer Processing
  • GEM/SECS Host Interface
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Cleaning
  • Developing
  • Etching
  • Plating
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering