SA 5000-AWP Fully-Automated
Benefits
- Optimized Process Performance
- Maximum Throughput
- Optimized Process Flexibility
- Reduced Energy Consumption
- Reduced DIW-Chemical Consumption
- Maximum Chemical Life
- Flexible Chemistry Applications
- Maximum Reliability
- Maintenance Friendly
- Easy to Use, Easy to Maintain
- Smallest Footprint Available
- Easy Installation
- Lowest Cost of Ownership
Standard Features
- 25 to 100 Wafer Lots
- 75mm to 300mm Wafers
- Dry In-Dry Out Process
- Bi-Directional- Multi-Lot Processing
- Parallel-Wafer Size Lot Processing
- Class 10 Mini Environment
- Advanced Intelligent Process Controls
- Advanced Intelligent Process Scheduler
- IN-Line Chemical Metrology System
- Automatic Chemical Fill
- Automatic Chemical Mixing-Dosing/Spiking
- Multi-Motion Agitation Profiles
- Optimized Wafer Handling
- 100% GEM Compliant
- Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
Industries
- Semiconductor
- Micro/Nano Electronics
- Compound Semiconductor
- Disk Drive
- Bio/Medical Devices
- Photonics
- Aerospace
- Automotive
- LED/OLEO
- Optics
- MEMS
- CPV
Applications
- Cleaning
- Developing
- Etching
- Electro-Plating
- Stripping
- Texturing
- Special Applications Engineering
Flexible Options
- Standard and Custom Applications
- 50 to 400 Wafer Buffer Queue
- Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
- Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
- Fixed or Multi-Frequency Megasonics 750kHz to 2.0mHz
- Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
- In Tank Dedicated Agitators 0-80 Cycles Per Min
- Bi-Directional Chemical Recirculation Flow
- Single or Double Sided Single Wafer Scrub Station
- Cassette-less Wafer Processing
- Drying Technologies
- Unlimited Automation
- Unlimited Options
Products and Services
- Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
- Batch and Single Wafer/Substrates
- Fully Automated, Semi Automated and Manual
- Bulk Chemical Distribution Systems
- Bulk Chemical Recovery Systems
- Bulk Chemical Mix and Distribution Systems
- OEM Wet Process Equipment Reconditioning and Upgrades
- Applications Engineering
SA 5000-HDM Fully-Automated
Benefits
- Pre and Post Sputter Cleaning and Etching
- Cassette-less Processing
- Automatic Chemical Concentration Controls
- Optimized Process Performance
- Maximum Throughput 500-2000 DPH
- Optimized Process Flexibility
- Reduced Energy Consumption
- Reduced DIW-Chemical Consumption
- Maximum Chemical Life
- Flexible Chemistry Applications
- Maximum Reliability
- Maintenance Friendly
- Easy to Use, Easy to Maintain
- Smallest Footprint Available
- Easy Installation
- Lowest Cost of Ownership
Standard Features
- 25 to 100 Wafer Lots
- 27mm to 95mm Disks
- Dry In-Dry Out/Wet In-Dry Out Process
- Lot Tracking via RFID System
- Bi-Directional Processing
- Parallel-HOM Size Lot Processing
- Class 10 Mini Environment
- Advanced Intelligent Process Controls
- Advanced Intelligent Process Scheduler
- IN-Line Chemical Metrology System
- Automatic Chemical Fill
- Automatic Chemical Mixing-Dosing/Spiking
- Multi-Motion Agitation Profiles
- Optimized HOM Handling
- Equipment Host Interface: Database/ MES
- Compliant Standards CE, FM, NFPA, NEC, SEMI 52, 58, SOP39
Industries
- Semiconductor
- Micro/Nano Electronics
- Compound Semiconductor
- Disk Drive
- Bio/Medical Devices
- Photonics
- Aerospace
- Automotive
- LED/OLEO
- Optics
- MEMS
- CPV
Applications
- Cleaning
- Etching
- Electro-Plating
- Stripping
- Texturing
- Special Applications Engineering
Flexible Options
- Standard and Custom Applications
- 100 to 400 HOM Buffer Queue
- Dry or Wet Input/Output Conveyors
- Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
- Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
- Fixed or Multi-Frequency Megasonics 750kHz to 3.0mHz
- Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
- In Tank Dedicated Agitators 0-80 Cycles Per Min
- Bi-Directional Chemical Recirculation Flow
- Drying Technologies
- Custom Automation/Options per your Request
Products and Services
- Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
- Batch and Single Wafer/Substrates
- Fully Automated, Semi Automated and Manual
- Bulk Chemical Distribution Systems
- Bulk Chemical Recovery Systems
- Bulk Chemical Mix and Distribution Systems
- OEM Wet Process Equipment Reconditioning and Upgrades
- Applications Engineering
SA 5000-SST Fully-Automated
Benefits
- Optimized Process Performance
- Maximum Throughput
- Optimized Process Flexibility
- Reduced Energy Consumption
- Reduced DIW-Chemical Consumption
- Maximum Chemical Life
- Flexible Chemistry Applications
- Maximum Reliability
- Maintenance Friendly
- Easy to Use, Easy to Maintain
- Smallest Footprint Available
- Easy Installation
- Lowest Cost of Ownership
Standard Features
- 25 to 100 Wafer Lots
- 75mm to 300mm Wafers
- Dry In-Dry Out Process
- Bi-Directional- Multi-Lot Processing
- Parallel-Wafer Size Lot Processing
- Dedicated Fire Suppression System
- Class 10 Mini Environment
- Advanced Intelligent Process Controls
- Advanced Intelligent Process Scheduler
- Advanced Rapid Heating System
- Automatic Chemical Fill and Tank to Tank Transfer
- Optimized Wafer Handling
- 100% GEM Compliant
- Compliant Standards ATEX, Class I dif. II, CE, FM, NFPA, NEC, SEMI S2, S8, SOP 39
Industries
- Semiconductor
- Micro/Nano Electronics
- Compound Semiconductor
- Disk Drive
- Bio/Medical Devices
- Photonics
- Aerospace
- Automotive
- LED/OLEO
- Optics
- MEMS
- CPV
Applications
- Cleaning
- Developing
- Etching
- Electro-Plating
- Photo-Electric Etching
- Stripping
- Texturing
- Special Applications Engineering
Flexible Options
- Standard and Custom Applications
- Vertical or Horizontal
- 50 to 400 Wafer Buffer Queue
- Class 10 Mini Environment
- Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
- Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
- Fixed or Multi-Frequency Megasonics 750kHz to 2.0mHz
- Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
- Products and Services
- In Tank Dedicated Agitators 0-80 Cycles Per Min
- Bi-Directional Chemical Recirculation Flow
- Single or Double Sided Single Wafer Scrub Station
- Drying Technologies
- Unlimited Automation
- Unlimited Options
Products and Services
- Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
- Batch and Single Wafer/Substrates
- Fully Automated, Semi Automated and Manual
- Bulk Chemical Distribution Systems
- Bulk Chemical Recovery Systems
- Bulk Chemical Mix and Distribution Systems
- OEM Wet Process Equipment Reconditioning and Upgrades
- Applications Engineering
SA 5000-SWP Fully-Automated
Benefits
- Optimized Process Performance
- Maximum Throughput
- Optimized Process Flexibility
- Reduced Energy Consumption
- Reduced DIW-Chemical Consumption
- Maximum Chemical Life
- Flexible Chemistry Applications
- Maximum Reliability
- Maintenance Friendly
- Easy to Use, Easy to Maintain
- Smallest Footprint Available
- Easy Installation
- Lowest Cost of Ownership
Standard Features
- Single Wafer Processing
- 75mm to 300mm Wafers
- Dry In-Dry Out Process
- Bi-Directional- Multi-Wafer Processing
- Parallel-Wafer Size Processing
- Class 10 Mini Environment
- Advanced Intelligent Process Controls
- Advanced Intelligent Process Scheduler
- IN-Line Chemical Metrology System
- Automatic Chemical Fill
- Automatic Chemical Mixing-Dosing/Spiking
- Multi-Motion Agitation Profiles
- Optimized Wafer Handling
- 100% GEM Compliant
- Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
Industries
- Semiconductor
- Micro/Nano Electronics
- Compound Semiconductor
- Disk Drive
- Bio/Medical Devices
- Photonics
- Aerospace
- Automotive
- LED/OLEO
- Optics
- MEMS
- CPV
Applications
- Solvent Strip
- Micro/Nano Strip
- NEG Resist Strip
- POS Resist Strip
- Metal Lift-Off
- Debonding
- Ink Removal
- Developing
- Special Applications Engineering
Flexible Options
- Standard and Custom Applications
- 50 to 400 Wafer Buffer Queue
- Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
- Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
- Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
- In Tank Dedicated Agitators 0-80 Cycles Per Min
- Bi-Directional Chemical Recirculation Flow
- Single or Double Sided Single Wafer Scrub Station
- Single or Double Sided Single Wafer High Pressure Spray Station
- Real Time IN-Line Chemical Metrology System
- Cassette-less Wafer Processing
- Drying Technologies
- Unlimited Automation
- Unlimited Options
Products and Services
- Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
- Batch and Single Wafer/Substrates
- Fully Automated, Semi Automated and Manual
- Bulk Chemical Distribution Systems
- Bulk Chemical Recovery Systems
- Bulk Chemical Mix and Distribution Systems
- OEM Wet Process Equipment Reconditioning and Upgrades
- Applications Engineering
AURORA Electroless Plating Fully-Automated
Benefits
- Thicknesses from Angstroms to Hundreds of Microns
- Maximum Throughput Batch Plating
- Automatic Deposition Rate Calculation
- Optimized Process Performance
- Optimized Process Flexibility
- Reduced Energy Consumption
- Reduced DIW-Chemical Consumption
- Maximum Chemical Life
- Flexible Chemistry Applications
- Maximum Reliability
- Maintenance Friendly
- Easy to Use, Easy to Maintain
- Smallest Footprint Available
- Easy Installation
- Lowest Cost of Ownership
Standard Features
- Pretreatment, Electroless Plating, Rinse and Dry
- 5 to 50 Wafer Lots
- 25mm to 200mm Wafers
- Dry In-Dry Out Process
- Cassette-less Wafer Processing
- Multi-Lot Processing
- Parallel-Wafer Size Lot Processing
- Class 10 Mini Environment
- Advanced Intelligent Process Controls
- Advanced Intelligent Process Scheduler
- IN-Line Chemical Metrology System
- Automatic Chemical Fill
- Automatic Chemical Mixing-Dosing/Spiking
- Optimized Wafer Handling
- 100% GEM Compliant
- Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
Industries
- Semiconductor
- Micro/Nano Electronics
- Compound Semiconductor
- Disk Drive
- Bio/Medical Devices
- Photonics
- Aerospace
- Automotive
- LED/OLEO
- Optics
- MEMS
- CPV
Applications
- Au Plating (Gold)
- Cu Plating (Copper) Seed Layer, Barrier, Pad, RDL, Pillar
- Ni Plating (Nickel)
- Pd Plating (Palladium)
- Special Applications Engineering
Flexible Options
- Standard and Custom Applications
- 5 to 400 Wafer Buffer Queue
- Drying Technologies
- Unlimited Automation
- Unlimited Options
Products and Services
- Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
- Batch and Single Wafer/Substrates
- Fully Automated, Semi Automated and Manual
- Bulk Chemical Distribution Systems
- Bulk Chemical Recovery Systems
- Bulk Chemical Mix and Distribution Systems
- OEM Wet Process Equipment Reconditioning and Upgrades
- Applications Engineering
SA 2000-SL Semi-Automated
Benefits
- Optimized Process Performance
- Maximum Throughput
- Optimized Process Flexibility
- Reduced Energy Consumption
- Reduced DIW-Chemical Consumption
- Maximum Chemical Life
- Flexible Chemistry Applications
- Maximum Reliability
- Maintenance Friendly
- Easy to Use, Easy to Maintain
- Smallest Footprint Available
- Easy Installation
- Lowest Cost of Ownership
Standard Features
- Rotational Tank to Tank Transfer
- Multi-Tank Operation
- 25 to 100 Wafer Lots
- 75mm to 300mm Wafers
- Multi-Step Processing Recipes
- Multi-Wafer Size Lot Processing
- Advanced Intelligent Process Controls
- Multi-Motion Agitation Profiles
- Advanced Wafer Handling
- Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
Industries
- Semiconductor
- Micro/Nano Electronics
- Compound Semiconductor
- Disk Drive
- Bio/Medical Devices
- Photonics
- Aerospace
- Automotive
- LED/OLEO
- Optics
- MEMS
- CPV
Applications
- Cleaning
- Developing
- Etching
- Plating
- Stripping
- Texturing
- Special Applications Engineering
Flexible Options
- Standard and Custom Applications
- Automated Load Port Door
- Class 10 Mini Environment
- Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
- Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
- Automatic Chemical Fill
- Automatic Chemical Mixing-Dosing/Spiking
- IN-Line Chemical Metrology System
- Fixed or Multi-Frequency Megasonics 750kHz to 2.0mHz
- Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
- In Tank Dedicated Agitators 0-80 Cycles Per Min
- Bi-Directional Chemical Recirculation Flow
- Single or Double Sided Single Wafer Scrub Station
- Cassette-less Wafer Processing
- GEM/SECS Host Interface
- Drying Technologies
- Unlimited Automation
- Unlimited Options
Products and Services
- Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
- Batch and Single Wafer/Substrates
- Fully Automated, Semi Automated and Manual
- Bulk Chemical Distribution Systems
- Bulk Chemical Recovery Systems
- Bulk Chemical Mix and Distribution Systems
- OEM Wet Process Equipment Reconditioning and Upgrades
- Applications Engineering
SA 2000-RT Semi-Automated
Benefits
- Optimized Process Performance
- Maximum Throughput
- Optimized Process Flexibility
- Reduced Energy Consumption
- Reduced DIW-Chemical Consumption
- Maximum Chemical Life
- Flexible Chemistry Applications
- Maximum Reliability
- Maintenance Friendly
- Easy to Use, Easy to Maintain
- Smallest Footprint Available
- Easy Installation
- Lowest Cost of Ownership
Standard Features
- Front to Back Tank to Tank Transfer
- Multi-Tank Operation
- 25 to 1 00 Wafer Lots
- 75mm to 300mm Wafers
- Multi-Step Processing Recipes
- Multi-Wafer Size Lot Processing
- Automated Load Port Door
- Class 10 Mini Environment
- Advanced Intelligent Process Controls
- IN-Line Chemical Metrology System
- Automatic Chemical Fill
- Automatic Chemical Mixing-Dosing/Spiking
- Multi-Motion Agitation Profiles
- Optimized Wafer Handling
- 100% GEM Compliant
- Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
Industries
- Semiconductor
- Micro/Nano Electronics
- Compound Semiconductor
- Disk Drive
- Bio/Medical Devices
- Photonics
- Aerospace
- Automotive
- LED/OLEO
- Optics
- MEMS
- CPV
Applications
- Cleaning
- Developing
- Etching
- Plating
- Stripping
- Texturing
- Special Applications Engineering
Flexible Options
- Standard and Custom Applications
- Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
- Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
- Fixed or Multi-Frequency Megasonics 750kHz to 2.0mHz
- Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
- In Tank Dedicated Agitators 0-80 Cycles Per Min
- Bi-Directional Chemical Recirculation Flow
- Single or Double Sided Single Wafer Scrub Station
- Cassette-less Wafer Processing
- GEM/SECS Host Interface
- Drying Technologies
- Unlimited Automation
- Unlimited Options
Products and Services
- Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
- Batch and Single Wafer/Substrates
- Fully Automated, Semi Automated and Manual
- Bulk Chemical Distribution Systems
- Bulk Chemical Recovery Systems
- Bulk Chemical Mix and Distribution Systems
- OEM Wet Process Equipment Reconditioning and Upgrades
- Applications Engineering
SA 2000-LT Semi-Automated
Benefits
- Optimized Process Performance
- Maximum Throughput
- Optimized Process Flexibility
- Reduced Energy Consumption
- Reduced DIW-Chemical Consumption
- Maximum Chemical Life
- Flexible Chemistry Applications
- Maximum Reliability
- Maintenance Friendly
- Easy to Use, Easy to Maintain
- Smallest Footprint Available
- Easy Installation
- Lowest Cost of Ownership
Standard Features
- Front-to-Back Tank-to-tank Transfer
- Multi-Tank Operation
- 25 to 100 Wafer Lots
- 75mm to 300mm Wafers
- Multi-Step Processing Recipes
- Multi-Wafer Size Lot Processing
- Advanced Intelligent Process Controls
- Multi-Motion Agitation Profile
- Advanced Wafer Handling
- Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP 39
Industries
- Semiconductor
- Micro/Nano Electronics
- Compound Semiconductor
- Disk Drive
- Bio/Medical Devices
- Photonics
- Aerospace
- Automotive
- LED/OLEO
- Optics
- MEMS
- CPV
Applications
- Cleaning
- Developing
- Etching
- Plating
- Stripping
- Texturing
- Special Applications Engineering
Flexible Options
- Standard and Custom Applications
- Automated Load Port Door
- Class 10 Mini Environment
- Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
- Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
- Automatic Chemical Fill
- Automatic Chemical Mixing-Dosing/Spiking
- IN-Line Chemical Metrology System
- Fixed or Multi-Frequency Megasonics 750kHz to 2.0mHz
- Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
- In Tank Dedicated Agitators 0-80 Cycles Per Min
- Bi-Directional Chemical Recirculation Flow
- Single or Double Sided Single Wafer Scrub Station
- Cassette-less Wafer Processing
- GEM/SECS Host Interface
- Drying Technologies
- Unlimited Automation
- Unlimited Options
Products and Services
- Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
- Batch and Single Wafer/Substrates
- Fully Automated, Semi Automated and Manual
- Bulk Chemical Distribution Systems
- Bulk Chemical Recovery Systems
- Bulk Chemical Mix and Distribution Systems
- OEM Wet Process Equipment Reconditioning and Upgrades
- Applications Engineering
SA 2000-HT Semi-Automated
Specially Designed for Sapphire Etching Silicon Carbide Etching High Temperature Etching Up to 425 deg.
Benefits
- Optimized Process Performance
- Maximum Throughput
- Optimized Process Flexibility
- Reduced Energy Consumption
- Reduced DIW-Chemical Consumption
- Maximum Chemical Life
- Flexible Chemistry Applications
- Maximum Reliability
- Maintenance Friendly
- Easy to Use, Easy to Maintain
- Smallest Footprint Available
- Easy Installation
- Lowest Cost of Ownership
Standard Features
- Front to Back Tank to tank Transfer
- Multi-Tank Operation
- Advance Safety Features
- High Temperature Quartz Processing Vessel (Rating 425 deg. C)
- 25 to 100 Wafer Lots
- 75mm to 300mm Wafers
- Automatic Chemical Fill
- Automatic Chemical Mixing Dosing/ Spiking
- Multi-Step Processing Recipes
- Multi-Wafer Size Lot Processing
- Multi-Lot Processing
- Advanced Intelligent Process Controls
- Multi-Motion Agitation Profile
- Optimized Wafer Handling
- Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP 39
Industries
- Semiconductor
- Micro/Nano Electronics
- Compound Semiconductor
- Disk Drive
- Bio/Medical Devices
- Photonics
- Aerospace
- Automotive
- LED/OLEO
- Optics
- MEMS
- CPV
Applications
- Etching
- Stripping
- Texturing
- Special Applications Engineering
Flexible Options
- Standard and Custom Applications
- Quartz Carriers
- Cassette to Carrier Wafer Transfer
- Automated Load Port Door
- Class 10 Mini Environment
- Hot Dl Water Rinse
- Cassette-less Wafer Processing
- Drying Technologies
- GEM/SECS Interface
- Unlimited Automation
- Unlimited Options
Products and Services
- Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
- Batch and Single Wafer/Substrates
- Fully Automated, Semi Automated and Manual
- Bulk Chemical Distribution Systems
- Bulk Chemical Recovery Systems
- Bulk Chemical Mix and Distribution Systems
- OEM Wet Process Equipment Reconditioning and Upgrades
- Applications Engineering
SA 1000-SST Solvent Strip Tool Manual
Benefits
- Optimized Process Performance
- Maximum Throughput
- Optimized Process Flexibility
- Reduced Energy Consumption
- Reduced DIW-Chemical Consumption
- Maximum Chemical Life
- Flexible Chemistry Applications
- Maximum Reliability
- Maintenance Friendly
- Easy to Use, Easy to Maintain
- Smallest Footprint Available
- Easy Installation
- Lowest Cost of Ownership
Standard Features
- 25 to 100 Wafer Lots
- 75mm to 300mm Wafers
- Multi-Lot Processing
- Parallel-Wafer Size Lot Processing
- Dedicated Fire Suppression System
- Advanced Intelligent Process Controls
- Compliant Standards ATEX, Class I dif. II, CE, FM, NFPA, NEC, SEMI S2, S8, SOP 39
Industries
- Semiconductor
- Micro/Nano Electronics
- Compound Semiconductor
- Disk Drive
- Bio/Medical Devices
- Photonics
- Aerospace
- Automotive
- LED/OLEO
- Optics
- MEMS
- CPV
Applications
- Solvent Strip
- Micro/Nano Strip
- NEG Resist Strip
- POS Resist Strip
- Metal Lift-Off
- Debonding
- Ink Removal
- Developing
- Special Applications Engineering
Flexible Options
- Standard and Custom Applications
- Class 10 Mini Environment
- Automatic Chemical Fill
- Tank to Tank Transfer
- Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
- In Tank Dedicated Agitators 0-80 Cycles Per Min
- Bi-Directional Chemical Recirculation Flow
- Single or Double Sided Single Wafer Scrub Station
- Single or Double Sided Single Wafer High Pressure Spray Station
- Real Time In-Situ Chemical Metrology System
- GEM/SECS Host Interface
- Drying Technologies
- Unlimited Automation
- Unlimited Options
Products and Services
- Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
- Batch and Single Wafer/Substrates
- Fully Automated, Semi Automated and Manual
- Bulk Chemical Distribution Systems
- Bulk Chemical Recovery Systems
- Bulk Chemical Mix and Distribution Systems
- Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools)
- OEM Wet Process Equipment Reconditioning and Upgrades
- Applications Engineering
SA 1000 Manual Electro Plater
Benefits
- Optimized Process Performance
- Superior Process Uniformity
- Maximum Throughput
- Optimized Process Flexibility
- Reduced Energy Consumption
- Reduced DIW-Chemical Consumption
- Maximum Chemical Life
- Flexible Chemistry Applications
- Maximum Reliability
- Maintenance Friendly
- Easy to Use, Easy to Maintain
- Smallest Footprint Available
- Easy Installation
- Lowest Cost of Ownership
Standard Features
- 1 to 8 Plating Cells
- Horizontal or Vertical Plating Cells
- 25mm to 300mm Wafers
- Multi-Wafer Processing
- Parallel -Wafer Size Processing
- Advanced Intelligent Process Controls
- Programmable Power Supply: Voltage, Current, Ramp Rate, Pulse Width
- Multi-Step Recipe: Pulse (FWD/REV) or DC
- Superior Temperature Controls 15C-80C
- Programmable Recirculation Flow Rate
- Reclaimable Process Chemistry
- 100% GEM Compliant
- Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, P39
Industries
- Semiconductor
- Micro/Nano Electronics
- Compound Semiconductor
- Disk Drive
- Bio/Medical Devices
- Photonics
- Aerospace
- Automotive
- LED/OLEO
- Optics
- MEMS
- CPV
Applications
- Electro Plating
- Electro-Magnetic Plating Cells
- Fountain Plating Cells
- Paddle Plating Cells
- Au Plating (Gold)
- Cu Plating (Copper)
- Co Plating (Cobalt)
- Ni Plating (Nickel)
- Ni/Co Plating (Nickel/Cobalt)
- NiFe Plating (Nickel Iron)
- NiFeCo Plating (Nickel/Iron/Cobalt)
- Special Applications Engineering
Flexible Options
- Standard and Custom Applications
- Class 10 Mini Environment
- Automatic Plating Rate Calculation
- IN-Line Chemical Metrology System
- Automatic Chemical Fill
- Automatic Chemical Add Back/Dosing/Spiking
- Single and Multi Wafer Fixtures
- Multi Ch. Segmented Fixtures
- Custom Fixtures
- Multi Channel Power Supplies
- Drying Technologies
- Unlimited Automation
- Unlimited Options
Products and Services
- Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
- Batch and Single Wafer/Substrates
- Fully Automated, Semi Automated and Manual
- Bulk Chemical Distribution Systems
- Bulk Chemical Recovery Systems
- Bulk Chemical Mix and Distribution Systems
- Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools
- OEM Wet Process Equipment Reconditioning and Upgrades
- Applications Engineering
SA1000 Manual
Benefits
- Optimized Process Performance
- Maximum Throughput
- Optimized Process Flexibility
- Reduced Energy Consumption
- Reduced DIW-Chemical Consumption
- Maximum Chemical Life
- Flexible Chemistry Applications
- Maximum Reliability
- Maintenance Friendly
- Easy to Use, Easy to Maintain
- Smallest Footprint Available
- Easy Installation
- Lowest Cost of Ownership
Standard Features
- 25 to 100 Wafer Lots
- 75mm to 300mm Wafers
- Multi-Lot Processing
- Parallel-Wafer Size Lot Processing
- Advanced Intelligent Process Controls
- Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
Industries
- Semiconductor
- Micro/Nano Electronics
- Compound Semiconductor
- Disk Drive
- Bio/Medical Devices
- Photonics
- Aerospace
- Automotive
- LED/OLEO
- Optics
- MEMS
- CPV
Applications
- Cleaning
- Developing
- Etching
- Electro-Plating
- Stripping
- Texturing
- Special Applications Engineering
Flexible Options
- Standard and Custom Applications
- Class 10 Mini Environment
- Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
- Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
- IN-Line Chemical Metrology System
- Automatic Chemical Fill
- Automatic Chemical Mixing-Dosing/Spiking
- Fixed or Multi-Frequency Megasonics’s 750kHz to 2.0mHz
- Fixed or Multi-Frequency Ultrasonic’s 25kHz to 430kHz
- In Tank Dedicated Agitators 0-80 Cycles Per Min
- Bi-Directional Chemical Recirculation Flow
- Single or Double Sided Single Wafer Scrub Station
- Cassette-less Wafer Processing
- Drying Technologies
- Unlimited Automation
- Unlimited Options
Products and Services
- Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
- Batch and Single Wafer/Substrates
- Fully Automated, Semi Automated and Manual
- Bulk Chemical Distribution Systems
- Bulk Chemical Recovery Systems
- Bulk Chemical Mix and Distribution Systems
- Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools
- OEM Wet Process Equipment Reconditioning and Upgrades
- Applications Engineering
SA100 LAB-FAB Fume Hood Stations
Benefits
- Low Cost
- Optimized Process Performance
- Reduced Energy Consumption
- Reduced DIW-Chemical Consumption
- Flexible Chemistry Applications
- Maximum Reliability
- Maintenance Friendly
- Easy to Use, Easy to Maintain
- Smallest Footprint Available
- Easy Installation
- Lowest Cost of Ownership
Standard Features
- Large Working Deck
- LED Deck Lighting
- Above Deck Storage Shelf
- Exhausted Chemical Bottle Storage Area
- Above Deck Empty Bottle Storage
- N2 & Dl Water Guns
- Flexible Process Controls
- Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
Industries
- Semiconductor
- Micro/Nano Electronics
- Compound Semiconductor
- Disk Drive
- Bio/Medical Devices
- Photonics
- Aerospace
- Automotive
- LED/OLEO
- Optics
- MEMS
- CPV
Applications
- Cleaning
- Developing
- Etching
- Electro-Plating
- Stripping
- Texturing
- Special Applications Engineering
Flexible Options
- Standard and Custom Applications
- Class 10 Mini Environment
- Dedicated Fire Suppression Systems
- Fixed or Multi-Frequency Megasonics 750kHz to 2.0mHz
- Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
- Hot Plates
- Single Wafer Spin Processors (Acids/Bases/Photo-Resist/Solvents)
- Single or Double Sided Single Wafer Scrub Station
- Drying Technologies
- Unlimited Automation
- Unlimited Options
Products and Services
- Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
- Batch and Single Wafer/Substrates
- Fully Automated, Semi Automated and Manual
- Bulk Chemical Distribution Systems
- Bulk Chemical Recovery Systems
- Bulk Chemical Mix and Distribution Systems
- OEM Wet Process Equipment Reconditioning and Upgrades
- Applications Engineering