Manual Benches

SA manual benches are extremely cost-efficient solutions with a variety of flexible options and potential applications. Below are just a few examples of tools we have custom made for several applications. 

Standard Features
  • 25 to 100 Wafer Lots
  • 75mm to 300mm Wafers
  • Multi-Lot Processing
  • Parallel-Wafer Size Lot Processing
  • Dedicated Fire Suppression System
  • Advanced Intelligent Process Controls
  • Compliant Standards ATEX, Class I dif. II, CE, FM, NFPA, NEC, SEMI S2, S8, SOP 39
  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Standard and Custom Applications
  • Class 10 Mini Environment
  • Automatic Chemical Fill
  • Tank to Tank Transfer
  • Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Single or Double Sided Single Wafer Scrub Station
  • Single or Double Sided Single Wafer High Pressure Spray Station
  • Real Time In-Situ Chemical Metrology System
  • GEM/SECS Host Interface
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Solvent Strip
  • Micro/Nano Strip
  • NEG Resist Strip
  • POS Resist Strip
  • Metal Lift-Off
  • Debonding
  • Ink Removal
  • Developing
  • Special Applications Engineering
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools)
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering
Standard Features
  • 1 to 8 Plating Cells
  • Horizontal or Vertical Plating Cells
  • 25mm to 300mm Wafers
  • Multi-Wafer Processing
  • Parallel -Wafer Size Processing
  • Advanced Intelligent Process Controls
  • Programmable Power Supply: Voltage, Current, Ramp Rate, Pulse Width
  • Multi-Step Recipe: Pulse (FWD/REV) or DC
  • Superior Temperature Controls 15C-80C
  • Programmable Recirculation Flow Rate
  • Reclaimable Process Chemistry
  • 100% GEM Compliant
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, P39
  • Optimized Process Performance
  • Superior Process Uniformity
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Standard and Custom Applications
  • Class 10 Mini Environment
  • Automatic Plating Rate Calculation
  • IN-Line Chemical Metrology System
  • Automatic Chemical Fill
  • Automatic Chemical Add Back/Dosing/Spiking
  • Single and Multi Wafer Fixtures
  • Multi Ch. Segmented Fixtures
  • Custom Fixtures
  • Multi Channel Power Supplies
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Electro Plating
  • Electro-Magnetic Plating Cells
  • Fountain Plating Cells
  • Paddle Plating Cells
  • Au Plating (Gold)
  • Cu Plating (Copper)
  • Co Plating (Cobalt)
  • Ni Plating (Nickel)
  • Ni/Co Plating (Nickel/Cobalt)
  • NiFe Plating (Nickel Iron)
  • NiFeCo Plating (Nickel/Iron/Cobalt)
  • Special Applications Engineering
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering
superior automation machine options
Standard Features
  • 25 to 100 Wafer Lots
  • 75mm to 300mm Wafers
  • Multi-Lot Processing
  • Parallel-Wafer Size Lot Processing
  • Advanced Intelligent Process Controls
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Standard and Custom Applications
  • Class 10 Mini Environment
  • Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
  • Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
  • IN-Line Chemical Metrology System
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • Fixed or Multi-Frequency Megasonics’s 750kHz to 2.0mHz
  • Fixed or Multi-Frequency Ultrasonic’s 25kHz to 430kHz
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Single or Double Sided Single Wafer Scrub Station
  • Cassette-less Wafer Processing
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Cleaning
  • Developing
  • Etching
  • Electro-Plating
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering
Standard Features
  • Large Working Deck
  • LED Deck Lighting
  • Above Deck Storage Shelf
  • Exhausted Chemical Bottle Storage Area
  • Above Deck Empty Bottle Storage
  • N2 & Dl Water Guns
  • Flexible Process Controls
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
  • Optimized Process Performance
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Cleaning
  • Developing
  • Etching
  • Electro-Plating
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Standard and Custom Applications
  • Class 10 Mini Environment
  • Dedicated Fire Suppression Systems
  • Fixed or Multi-Frequency Megasonics 750kHz to 2.0mHz
  • Fixed or Multi-Frequency Ultrasonics 25kHz to 430kHz
  • Hot Plates
  • Single Wafer Spin Processors (Acids/Bases/Photo-Resist/Solvents)
  • Single or Double Sided Single Wafer Scrub Station
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering