SA 5000-AWP Fully-Automated

  • Automatic Etch Rate Calculation
  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • 25 to 1 00 Wafer Lots
  • 75mm to 300mm Wafers
  • Dry In-Dry Out Process
  • Bi-Directional- Multi-Lot Processing
  • Parallel-Wafer Size Lot Processing
  • Class 10 Mini Environment
  • Advanced Intelligent Process Controls
  • Advanced Intelligent Process Scheduler
  • IN-Line Chemical Metrology System
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • Multi-Motion Agitation Profiles
  • Optimized Wafer Handling
  • 100% GEM Compliant
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Cleaning
  • Developing
  • Etching
  • Electro-Plating
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Standard and Custom Applications
  • 50 to 400 Wafer Buffer Queue
  • Fixed or Multi-Frequency Megasonics’s 750kHz to 2.0mHz
  • Fixed or Multi-Frequency Ultrasonic’s 25kHz to 430kHz
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Single or Double Sided Single Wafer Scrub Station
  • Cassette-less Wafer Processing
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering

SA 5000-HDM Fully-Automated

  • Pre and Post Sputter Cleaning and Etching
  • Cassette-less Processing
  • Automatic Chemical Concentration Controls
  • Optimized Process Performance
  • Maximum Throughput 500-2000 DPH
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • 25 to 100 HOM Lots
  • 27mm to 95mm Disks
  • Dry In-Dry Out/Wet In-Dry Out Process
  • Lot Tracking via RFID System
  • Bi-Directional Processing
  • Parallel-HOM Size Lot Processing
  • Class 10 Mini Environment
  • Advanced Intelligent Process Controls
  • Advanced Intelligent Process Scheduler
  • IN-Line Chemical Metrology System
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • Multi-Motion Agitation Profiles
  • Optimized HOM Handling
  • Equipment Host Interface: Database/ MES
  • Compliant Standards CE, FM, NFPA, NEC, SEMI 52, 58,SOP39
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Cleaning
  • Etching
  • Electro-Plating
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Standard and Custom Applications
  • 100 to 400 HOM Buffer Queue
  • Dry or Wet Input/Output Conveyors
  • Fixed or Multi-Frequency Megasonics’s 750kHz to 3.0mHz
  • Fixed or Multi-Frequency Ultrasonic’s 25kHz to 430kHz
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering

SA 5000-SST Fully-Automated

  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • 25 to 100 Wafer Lots
  • 75mm to 300mm Wafers
  • Dry In-Dry Out Process
  • Bi-Directional- Multi-Lot Processing
  • Parallel-Wafer Size Lot Processing
  • Dedicated Fire Suppression System
  • Class 10 Mini Environment
  • Advanced Intelligent Process Controls
  • Advanced Intelligent Process Scheduler
  • Advanced Rapid Heating System
  • Automatic Chemical Fill and Tank to Tank Transfer
  • Optimized Wafer Handling
  • 100% GEM Compliant
  • Compliant Standards ATEX, Class I dif. II, CE, FM,NFPA, NEC, SEMI S2, S8, SOP 39
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Cleaning
  • Developing
  • Etching
  • Electro-Plating
  • Photo-Electric Etching
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Standard and Custom Applications
  • Vertical or Horizontal
  • 50 to 400 Wafer Buffer Queue
  • Class 10 Mini Environment
  • Fixed or Multi-Frequency Megasonics’s 750kHz to 2.0mHz
  • Fixed or Multi-Frequency Ultrasonic’s 25kHz to 430kHz
  • Products and Services
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Single or Double Sided Single Wafer Scrub Station
  • Drying Technologie
  • Unlimited Automation
  • Unlimited Options
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering

SA 5000-SWP Fully-Automated

  • Automatic Etch Rate Calculation
  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Single Wafer Processing
  • 75mm to 300mm Wafers
  • Dry In-Dry Out Process
  • Bi-Directional- Multi-Wafer Processing
  • Parallel-Wafer Size Processing
  • Class 10 Mini Environment
  • Advanced Intelligent Process Controls
  • Advanced Intelligent Process Scheduler
  • IN-Line Chemical Metrology System
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • Multi-Motion Agitation Profiles
  • Optimized Wafer Handling
  • 100% GEM Compliant
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Solvent Strip
  • Micro/Nano Strip
  • NEG Resist Strip
  • POS Resist Strip
  • Metal Lift-Off
  • Debonding
  • Ink Removal
  • Developing
  • Special Applications Engineering
  • Standard and Custom Applications
  • 50 to 400 Wafer Buffer Queue
  • Fixed or Multi-Frequency Ultrasonic’s 25kHz to 430kHz
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Single or Double Sided Single Wafer Scrub Station
  • Single or Double Sided Single Wafer High Pressure Spray Station
  • Real Time IN-Line Chemical Metrology System
  • Cassette-less Wafer Processing
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering

AURORA ElectroLess Plating Fully-Automated

  • Angstroms to Hundreds of Microns
  • Maximum Throughput Batch Plating
  • Automatic Deposition Rate Calculation
  • Optimized Process Performance
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Pretreatment, Electroless Plating, Rinse and Dry
  • 5 to 50 Wafer Lots
  • 25mm to 200mm Wafers
  • Dry In-Dry Out Process
  • Cassette-less Wafer Processing
  • Multi-Lot Processing
  • Parallel-Wafer Size Lot Processing
  • Class 10 Mini Environment
  • Advanced Intelligent Process Controls
  • Advanced Intelligent Process Scheduler
  • IN-Line Chemical Metrology System
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • Optimized Wafer Handling
  • 100% GEM Compliant
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Au Plating (Gold)
  • Cu Plating (Copper) Seed Layer, Barrier, Pad, RDL, Pillar
  • Ni Plating (Nickel)
  • Pd Plating (Palladium)
  • Special Applications Engineering
  • Standard and Custom Applications
  • 5 to 400 Wafer Buffer Queue
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering

SA 2000-SL Semi-Automated

  • Automatic Etch Rate Calculation
  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Rotational Tank to Tank Transfer
  • Multi-Tank Operation
  • 25 to 100 Wafer Lots
  • 75mm to 300mm Wafers
  • Multi-Step Processing Recipes
  • Multi-Wafer Size Lot Processing
  • Advanced Intelligent Process Controls
  • Multi-Motion Agitation Profiles
  • Advanced Wafer Handling
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Cleaning
  • Developing
  • Etching
  • Plating
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Standard and Custom Applications
  • Automated Load Port Door
  • Class 10 Mini Environment
  • Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
  • Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • IN-Line Chemical Metrology System
  • Fixed or Multi-Frequency Megasonics’s 750kHz to 2.0mHz
  • Fixed or Multi-Frequency Ultrasonic’s 25kHz to 430kHz
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Single or Double Sided Single Wafer Scrub Station
  • Cassette-less Wafer Processing
  • GEM/SECS Host Interface
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools)
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering

SA 2000-RT Semi-Automated

  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Front to Back Tank to Tank Transfer
  • Multi-Tank Operation
  • 25 to 1 00 Wafer Lots
  • 75mm to 300mm Wafers
  • Multi-Step Processing Recipes
  • Multi-Wafer Size Lot Processing
  • Automated Load Port Door
  • Class 10 Mini Environment
  • Advanced Intelligent Process Controls
  • IN-Line Chemical Metrology System
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • Multi-Motion Agitation Profiles
  • Optimized Wafer Handling
  • 100% GEM Compliant
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Cleaning
  • Developing
  • Etching
  • Plating
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Standard and Custom Applications
  • Fixed or Multi-Frequency Megasonics’s 750kHz to 2.0mHz
  • Fixed or Multi-Frequency Ultrasonic’s 25kHz to 430kHz
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Single or Double Sided Single Wafer Scrub Station
  • Cassette-less Wafer Processing
  • GEM/SECS Host Interface
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools)
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering

SA 2000-LT Semi-Automated

  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Front to Back Tank to tank Transfer
  • Multi-Tank Operation
  • 25 to 100 Wafer Lots
  • 75mm to 300mm Wafers
  • Multi-Step Processing Recipes
  • Multi-Wafer Size Lot Processing
  • Advanced Intelligent Process Controls
  • Multi-Motion Agitation Profile
  • Advanced Wafer Handling
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP 39
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Cleaning
  • Developing
  • Etching
  • Plating
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Standard and Custom Applications
  • Automated Load Port Door
  • Class 10 Mini Environment
  • Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
  • Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • IN-Line Chemical Metrology System
  • Fixed or Multi-Frequency Megasonics’s 750kHz to 2.0mHz
  • Fixed or Multi-Frequency Ultrasonic’s 25kHz to 430kHz
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Single or Double Sided Single Wafer Scrub Station
  • Cassette-less Wafer Processing
  • GEM/SECS Host Interface
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools)
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering

SA 2000-HT Semi-Automated

Specially Designed for Sapphire Etching Silicon Carbide Etching High Temperature Etching Up to 425 deg. C

  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Front to Back Tank to tank Transfer
  • Multi-Tank Operation
  • Advance Safety Features
  • High Temperature Quartz Processing Vessel (Rating 425 deg. C)
  • 25 to 100 Wafer Lots
  • 75mm to 300mm Wafers
  • Automatic Chemical Fill
  • Automatic Chemical Mixing Dosing/ Spiking
  • Multi-Step Processing Recipes
  • Multi-Wafer Size Lot Processing
  • Multi-Lot Processing
  • Advanced Intelligent Process Controls
  • Multi-Motion Agitation Profile
  • Optimized Wafer Handling
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP 39
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Etching
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Standard and Custom Applications
  • Quartz Carriers
  • Cassette to Carrier Wafer Transfer
  • Automated Load Port Door
  • Class 10 Mini Environment
  • Hot Dl Water Rinse
  • Cassette-less Wafer Processing
  • Drying Technologies
  • GEM/SECS Interface
  • Unlimited Automation
  • Unlimited Options
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools)
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering

SA 1000-SST Solvent Strip Tool Manual

  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • 25 to 100 Wafer Lots
  • 75mm to 300mm Wafers
  • Multi-Lot Processing
  • Parallel-Wafer Size Lot Processing
  • Dedicated Fire Suppression System
  • Advanced Intelligent Process Controls
  • Compliant Standards ATEX, Class I dif. II, CE, FM, NFPA, NEC, SEMI S2, S8, SOP 39
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Solvent Strip
  • Micro/Nano Strip
  • NEG Resist Strip
  • POS Resist Strip
  • Metal Lift-Off
  • Debonding
  • Ink Removal
  • Developing
  • Special Applications Engineering
  • Standard and Custom Applications
  • Class 10 Mini Environment
  • Automatic Chemical Fill
  • Tank to Tank Transfer
  • Fixed or Multi-Frequency Ultrasonic’s 25kHz to 430kHz
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Single or Double Sided Single Wafer Scrub Station
  • Single or Double Sided Single Wafer High Pressure Spray Station
  • Real Time IN-Line Chemical Metrology System
  • GEM/SECS Host Interface
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools)
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering

SA 1000 Manual Electro Plater

  • Optimized Process Performance
  • Superior Process Uniformity
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • 1 to 8 Plating Cells
  • Horizontal or Vertical Plating Cells
  • 25mm to 300mm Wafers
  • Multi-Wafer Processing
  • Parallel -Wafer Size Processing
  • Advanced Intelligent Process Controls
  • Programmable Power Supply: Voltage, Current, Ramp Rate,Pulse Width
  • Multi-Step Recipe: Pulse ( FWR/REV) or DC
  • Superior Temperature Controls 15C-80C
  • Programmable Recirculation Flow Rate
  • Reclaimable Process Chemistry
  • 1 00% GEM Compliant
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, P39
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Electro Plating
  • Electro-Magnetic Plating Cells
  • Fountain Plating Cells
  • Paddle Plating Cells
  • Au Plating (Gold)
  • Cu Plating (Copper)
  • Co Plating (Cobalt)
  • Ni Plating (Nickel)
  • Ni/Co Plating (Nickel/Cobalt)
  • Nife Plating (Nickel Iron)
  • NiFeCo Plating (Nickel/Iron/Cobalt)
  • Special Applications Engineering
  • Standard and Custom Applications
  • Class 10 Mini Environment
  • Automatic Plating Rate Calculation
  • IN-Line Chemical Metrology System
  • Automatic Chemical Fill
  • Automatic Chemical Add Back/Dosing/Spiking
  • Single and Multi Wafer Fixtures
  • Multi Ch. Segmented Fixtures
  • Custom Fixtures
  • Multi Channel Power Supply’s
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering

SA1000 Manual

  • Optimized Process Performance
  • Maximum Throughput
  • Optimized Process Flexibility
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Maximum Chemical Life
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • 25 to 100 Wafer Lots
  • 75mm to 300mm Wafers
  • Multi-Lot Processing
  • Parallel-Wafer Size Lot Processing
  • Advanced Intelligent Process Controls
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Cleaning
  • Developing
  • Etching
  • Electro-Plating
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Standard and Custom Applications
  • Class 10 Mini Environment
  • Automatic Process Time Calculation based on Etch Rate and Target Thickness Removal
  • Automatic etch rate/target thickness lookup from MES, SPC, and/or Metrology results data
  • IN-Line Chemical Metrology System
  • Automatic Chemical Fill
  • Automatic Chemical Mixing-Dosing/Spiking
  • Fixed or Multi-Frequency Megasonics’s 750kHz to 2.0mHz
  • Fixed or Multi-Frequency Ultrasonic’s 25kHz to 430kHz
  • In Tank Dedicated Agitators 0-80 Cycles Per Min
  • Bi-Directional Chemical Recirculation Flow
  • Single or Double Sided Single Wafer Scrub Station
  • Cassette-less Wafer Processing
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering

SA100 LAB-FAB Fume Hood Stations

  • Low Cost
  • Optimized Process Performance
  • Reduced Energy Consumption
  • Reduced DIW-Chemical Consumption
  • Flexible Chemistry Applications
  • Maximum Reliability
  • Maintenance Friendly
  • Easy to Use, Easy to Maintain
  • Smallest Footprint Available
  • Easy Installation
  • Lowest Cost of Ownership
  • Large Working Deck
  • LED Deck Lighting
  • Above Deck Storage Shelf
  • Exhausted Chemical Bottle Storage Area
  • Above Deck Empty Bottle Storage
  • N2 & Dl Water Guns
  • Flexible Process Controls
  • Compliant Standards CE, FM, NFPA, NEC, SEMI S2, S8, SOP39
  • Semiconductor
  • Micro/Nano Electronics
  • Compound Semiconductor
  • Disk Drive
  • Bio/Medical Devices
  • Photonics
  • Aerospace
  • Automotive
  • LED/OLEO
  • Optics
  • MEMS
  • CPV
  • Cleaning
  • Developing
  • Etching
  • Electro-Plating
  • Stripping
  • Texturing
  • Special Applications Engineering
  • Standard and Custom Applications
  • Class 10 Mini Environment
  • Dedicated Fire Suppression Systems
  • Fixed or Multi-Frequency Megasonics’s 750kHz to 2.0mHz
  • Fixed or Multi-Frequency Ultrasonic’s 25kHz to 430kHz
  • Hot Plates
  • Single Wafer Spin Processors (Acids/Bases/Photo-ResisUSolvents)
  • Single or Double Sided Single Wafer Scrub Station
  • Drying Technologies
  • Unlimited Automation
  • Unlimited Options
  • Wafer/Substrate Surface Cleaning, Etching, Plating, Stripping and Texturing Equipment
  • Batch and Single Wafer/Substrates
  • Fully Automated, Semi Automated and Manual
  • Bulk Chemical Distribution Systems
  • Bulk Chemical Recovery Systems
  • Bulk Chemical Mix and Distribution Systems
  • Equipment-Host Connectivity Solutions via SA- GemStation Software (GEM and non-GEM Compliant Tools
  • OEM Wet Process Equipment Reconditioning and Upgrades
  • Applications Engineering